PCB & MCPCB 2018-02-20T17:41:02+00:00

Features Included:

  • Operable components at lower temperatures
  • Durable
  • Flatness maintained in all 3 layers
  • High heat dissipation
  • High density of components
  • Reduced PCB size / small footprint
  • Higher watt density
  • Longer component life
  • Less hardware (topical heat sinks, screws, clips, etc)
  • Lower manufacturing cost


  • LEDs / Lighting
  • High Power LEDs
  • Voltage Regulators
  • Power Supply Boards / Power Modules
  • Power Conversion Boards
  • DC-DC Conversion Boards
  • AC-DC Conversion Boards
  • Amplifiers
  • Inverters
  • Motor Drivers / Controllers
  • Controllers
  • Relays
  • Transistor Base
  • Light Switch Boards
  • Digital Input / Output Boards
  • Automotive Boards

Single Layer, Multiple Layer MCPCB or FR4

  • Surface mounted components / wave soldering
  • Solder mask coloring
  • Machined features
  • Low / high volume
  • Turn key operation
  • Quick lead time / turn around
  • Testing
  • Cables / connectors

MCPCB Construction

A simple one layer MCPCB has 3 layers, the copper circuit layer, thermally conductive dielectric layer, and the metal core base layer. These three layers are then laminated together. The lamination technique bonds the three layers together providing a path for the heat to dissipate.

Metal Core Layer
This layer can be made out of aluminum, copper, or steel. Aluminum is most commonly used due to its cost, weight and thermal characteristics. Typical thickness for aluminum is 1.0mm to 3.2mm and typical aluminum alloys used are: AL6061, AL5052, AL1370, AL770, and AL710. In some cases where heat dissipation takes priority over cost, copper is used for the base layer. Typically a heat sink is attached to the metal base to further dissipate heat away from the components.

Dielectric Layer
The dielectric layer is the most important layer in a MCPCB because it must maintain electronic insulation while also being thermally conductive. The dielectrics thickness plays an important role because it must be thick enough so the copper circuit does not short out, yet thin enough to maintain high thermal performance. Typical thickness of this layer is between .075mm to .2mm (.003” – .008”). Thicker or thinner layers can be used depending on voltage and current.

Copper Circuit Layer
This layer is a traditional PCB circuit. The thickness can be anywhere between 35µm to 350µm (1 – 10 oz/ft2). A green or black solder mask coating covers the entire board to protect the circuit. Unlike PCBs a thicker copper layer can be used if the circuit requires a higher current.

Super Pillar

Design Concepts
• Build a Al/Cu Pillar through the MCPCB
• Bypass the pre-preg to eliminate one layer of
thermal resistance

Innovative Processes
• Mechanical shaping
• Flexible lamination scale
• Roll-to-roll manufacturing
• Stable production process

• Increase efficiency of thermal dissipation
• Withstand high power components
• Drive higher currents
• Allow usage of a lower cost process

• High Power Flux LED Products
• General Lighting
• Outdoor Lighting

More information available by visiting our COFAN PCB division homepage