TIMELINE
Below is a timeline highlighting the key milestones of our company
1994
1995
CPU Cooler Product Line Established
COFAN USA introduces its first Heatsink/Fan CPU cooler to positive reviews and high demand.
1999
Far East Manufacturing Established
COFAN USA, using its growing manufacturing expertise, introduces its Asia manufacturing staff and uses its program management skills to solve customers needs for low cost off-shore production for both high and low quantity needs.
2000
Begin Offshore Heatsink Manufacturing
COFAN USA begins offering design and offshore manufacturing services for custom sheet metal, die cast, extrusion and machined products.
2001
Beggin CFD Analysis Services
COFAN USA introduces state-of-the art CFD thermal analysis to enable a quick turnaround, all-in-one analysis of its customers’ thermal needs.
2003
Turnkey Manufacturing in China
COFAN USA establishes a factory in China and starts providing turnkey assembly for its customers.
2005
Begin MCPCB Manufacturing
COFAN USA enters the LED lighting business with the introduction of metal core PCB (MCPCB).
2009
COFAN PCB Established in Toronto & Taiwan
COFAN USA establishes the Taiwan MCPCB facility, and Canadian Sales, Marketing and engineering office.
2010
Super Pillar Patent Issued
COFAN USA introduced revolutionary patented Super Pilar technology.
2011
R&D Taiwan Team Established
COFAN USA establishes an R&D team in Taipei, Taiwan that allows us to provide around the clock engineering services. COFAN China was relocated to expand production capacity.
2012
Expand Taiwan R&D Team
COFAN USA expended R&D team in Taipei, Taiwan with introduction of COB technology.
2014
COFAN USA establishes the China PCB team.
COFAN USA establishes the China PCB team.
2017
COFAN Taiwan expanded production capacity.
COFAN Taiwan expanded production capacity.
2018
Cofan Precision established
COFAN USA acquired A&M Machining and established COFAN Precision